EZURiO development kit is designed to support the rapid development of hardware, applications and software for the EZURiO range of BISM II bluetooth intelligent serial modules
Thermal Interface Products Tflex 750 9x9" 5.0W/mK gap filler
Thermoelectric Modules OT12 18 F2A 0606 11 W2.25 6.0x7.2x2.7mm
Thermal Interface Products Tflex HR4190 9x9" 1.8W/mK gap filler
Thermal Interface Products TflexHR4190 DC1 9x9" 1.8W/mK gap filler
Thermal Interface Products Tflex 230V0 9" x 9" 1.1W/mK
Thermoelectric Modules PT6,12,F2,4040,TA,W6 40x44x3.8mm
Thermal Interface Products Tflex HR420 18x18" 1.8W/mK gap filler
Thermoelectric Modules CP10,254,06,L1,W4.5 60x30x3.6mm
Thermal Interface Products Tflex 3100 DC1 9x9" 1.2W/mK
Thermoelectric Modules OT16,18,F2,0606,11 W2.25 7.6x6.0x2mm
Thermal Interface Products Tgrease 2500 10cc 3.8W/mK Sil Free
Thermal Interface Products Tflex SF660 DF 8.5" x 9.0"
Thermoelectric Modules CP14,71,06,L1,EP,W6 30x30x3.8mm
Thermoelectric Modules OT08,32,F0,0707,11 W2.25 6.5x8.1x2.4mm
Thermoelectric Modules CP14,35,045L1,W4.5 15x30x3.3mm
Thermal Interface Products Tgard K52 3 0505 A0 11" x 18"
RF Development Tools RM024 Dev Kit Plug, 125mW, u.FL
Nickel / Copper conductive fabric tape with pressure sensetive adhesive
Thermal Interface Products Tgard K52,2,0505,A1 11" x 18"